US 11,798,726 B2
Coil component, circuit substrate, and electronic device
Kenji Yazawa, Tokyo (JP); and Atsushi Shimamura, Tokyo (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Sep. 21, 2020, as Appl. No. 17/27,174.
Claims priority of application No. 2019-178002 (JP), filed on Sep. 27, 2019.
Prior Publication US 2021/0098176 A1, Apr. 1, 2021
Int. Cl. H01F 27/255 (2006.01); H01F 1/34 (2006.01); H01F 27/28 (2006.01); H01F 41/02 (2006.01)
CPC H01F 27/255 (2013.01) [H01F 1/344 (2013.01); H01F 27/28 (2013.01); H01F 41/0246 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A coil component comprising:
a core including a plurality of ferrite crystal grains and a plurality of Bi segregated regions situated at a grain boundary of the plurality of ferrite crystal grains; and
a winding wound around the core,
wherein a plurality of line profiles obtained by detecting a content of Bi along a plurality of scanning lines intersecting with the grain boundary include at least one first line profile that has a detection peak of Bi at the grain boundary and two or more second line profiles that have no detection peak of Bi; and
wherein the plurality of scanning lines are set at equal intervals.