US 11,796,950 B2
Conductive sheet and sheet bundle package
Takashi Tomiyama, Sunto Shizuoka (JP); and Sadatoshi Oishi, Fuji Shizuoka (JP)
Assigned to TOSHIBA TEC KABUSHIKI KAISHA, Tokyo (JP)
Filed by TOSHIBA TEC KABUSHIKI KAISHA, Tokyo (JP)
Filed on Aug. 16, 2022, as Appl. No. 17/888,707.
Claims priority of application No. 2021-178653 (JP), filed on Nov. 1, 2021.
Prior Publication US 2023/0138589 A1, May 4, 2023
Int. Cl. G03G 15/00 (2006.01); H04N 1/32 (2006.01)
CPC G03G 15/5062 (2013.01) [H04N 1/32138 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A conductive sheet that is configured to be positioned between a sheet tray of an image forming device and a sheet, the conductive sheet comprising:
a base layer comprising a conductive material positioned to overlap with a wireless tag of the sheet; and
a double conveyance prevention structure coupled to or defined by the base layer, the double conveyance prevention structure configured to prevent conveyance of the conductive sheet by the image forming device when the conductive sheet overlaps the sheet in the sheet tray.