US 11,796,865 B2
Spacer-containing tape
Masahiro Iiyama, Utsunomiya (JP); and Reiji Tsukao, Utsunomiya (JP)
Assigned to DEXERIALS CORPORATION, Tokyo (JP)
Filed by DEXERIALS CORPORATION, Shimotsuke (JP)
Filed on Mar. 24, 2022, as Appl. No. 17/702,936.
Application 17/702,936 is a continuation of application No. 16/630,883, granted, now 11,327,368, previously published as PCT/JP2018/028629, filed on Jul. 31, 2018.
Claims priority of application No. 2017-160668 (JP), filed on Aug. 23, 2017.
Prior Publication US 2022/0254540 A1, Aug. 11, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G02F 1/1339 (2006.01); B32B 27/08 (2006.01); B32B 27/14 (2006.01); H01B 1/20 (2006.01); H01R 4/04 (2006.01)
CPC G02F 1/13392 (2013.01) [B32B 27/08 (2013.01); B32B 27/14 (2013.01); H01B 1/20 (2013.01); H01R 4/04 (2013.01); B32B 2307/202 (2013.01); B32B 2405/00 (2013.01); C09J 2203/318 (2013.01); C09J 2301/408 (2020.08); G02F 1/1339 (2013.01); G02F 1/13398 (2021.01)] 12 Claims
OG exemplary drawing
 
1. A conductive tape comprising a conductive particle-containing layer containing at least a binder resin layer and a plurality of conductive particles, wherein
the plurality of conductive particles are distributedly disposed independently from each other on one surface of the binder resin layer, each of the conductive particles being at least partially embedded in the binder resin layer,
a surface of the binder resin layer in a vicinity of each of the conductive particles has an inclination or an undulation with respect to a tangent plane of the binder resin layer in a centermost portion between adjacent conductive particles,
in the inclination, the surface of the binder resin layer directly adjacent to and contacting the conductive particle is indented below the tangent plane, and
in the undulation, a resin amount of the binder resin layer right above the conductive particle is smaller than that when the surface of the binder resin layer right above the conductive particle is flush with the tangent plane.