US 11,796,572 B2
Current sensing system
Lucian Barbut, Bevaix (CH); Simon Houis, Bevaix (CH); Lionel Tombez, Bevaix (CH); and Tim Vangerven, Tessenderlo (BE)
Assigned to MELEXIS TECHNOLOGIES SA, Bevaix (CH)
Filed by Melexis Technologies SA, Bevaix (CH)
Filed on Oct. 29, 2021, as Appl. No. 17/515,075.
Claims priority of application No. 20205078 (EP), filed on Oct. 31, 2020.
Prior Publication US 2022/0137100 A1, May 5, 2022
Int. Cl. G01R 15/20 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC G01R 15/202 (2013.01) [G01R 15/205 (2013.01); H05K 1/0213 (2013.01); H05K 1/181 (2013.01); H05K 2201/10151 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A current sensor system comprising a conductor and a packaged integrated circuit for sensing a current in said conductor, said conductor being external to said packaged integrated circuit, said packaged integrated circuit comprising:
a substrate having an active surface and a back surface,
one or more magnetic sensing elements disposed in or on said active surface of said substrate,
a processing circuit disposed in or on said active surface of said substrate and arranged to process signals received from said one or more magnetic sensing elements to derive an output signal indicative of a sensed current in said conductor,
a housing,
a plurality of leads having an outer lead portion extending outside said housing and an inner lead portion,
electrical connections between each of said plurality of leads and said active surface of said substrate,
wherein said back surface of said substrate is disposed on a support formed by at least two inner lead portions of said plurality of leads and said active side of said substrate is oriented towards the outer ends of said outer lead portions of said leads in a direction perpendicular to a plane defined by said support.