CPC C25D 11/34 (2013.01) [C25D 11/024 (2013.01); C25F 3/02 (2013.01)] | 7 Claims |
1. A method to treat a copper surface for a bonded coupling of a mixture of a polymer and copper, comprising:
(a) an etching step with electric etching of the surface of copper;
(b) a first anodizing stage to anodize the surface of copper; and
(c) a second anodizing stage to anodize the above firstly anodized copper;
wherein the stage (b), including anodizing for 1 to 15 minutes with a current density of 0.01˜5 A/dm2 while using a pulse rectifier at a temperature of 30 to 90° C. in a mixed solution comprising 0.01˜0.05 wt. % of NaNO2 as an electrolyte, 0.1˜1 wt. % of NH4F as an adjuvant, and 0.01˜0.1 wt. % C2H4(OH)2 as an additive; and
wherein in the stage (c), the second anodizing treatment proceeds with a mixed solution comprising 0.1˜2 wt. % of C2K2O4 as an electrolyte, 0.1˜0.5 wt. % of Na2O3Si as an adjuvant, 0.01˜0.1 wt. % of C3H8O3 as an adjuvant, and 0.001˜0.01 wt. % of C20H24Na2O10S2 as an adjuvant, while using the pulse rectifier for 500 ms at a temperature of 30 to 70° C., at a current density of 0.01˜1 A/dm2, for 1 to 10 minutes.
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