US 11,795,565 B2
Surface treatment method of copper for the assembly of polymer and copper
Guo Tie Long, Shenzhen (CN); and Tan Yonggang, Shenzhen (CN)
Assigned to DONGGUAN DSP TECHNOLOGY CO., LTD., Dongguan (CN)
Filed by DONGGUAN DSP TECHNOLOGY CO., LTD., Dongguan (CN)
Filed on Jun. 16, 2022, as Appl. No. 17/807,190.
Claims priority of application No. 2021-102058 (JP), filed on Jun. 18, 2021.
Prior Publication US 2022/0403543 A1, Dec. 22, 2022
Int. Cl. C25D 11/34 (2006.01); C25D 11/02 (2006.01); C25F 3/02 (2006.01)
CPC C25D 11/34 (2013.01) [C25D 11/024 (2013.01); C25F 3/02 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method to treat a copper surface for a bonded coupling of a mixture of a polymer and copper, comprising:
(a) an etching step with electric etching of the surface of copper;
(b) a first anodizing stage to anodize the surface of copper; and
(c) a second anodizing stage to anodize the above firstly anodized copper;
wherein the stage (b), including anodizing for 1 to 15 minutes with a current density of 0.01˜5 A/dm2 while using a pulse rectifier at a temperature of 30 to 90° C. in a mixed solution comprising 0.01˜0.05 wt. % of NaNO2 as an electrolyte, 0.1˜1 wt. % of NH4F as an adjuvant, and 0.01˜0.1 wt. % C2H4(OH)2 as an additive; and
wherein in the stage (c), the second anodizing treatment proceeds with a mixed solution comprising 0.1˜2 wt. % of C2K2O4 as an electrolyte, 0.1˜0.5 wt. % of Na2O3Si as an adjuvant, 0.01˜0.1 wt. % of C3H8O3 as an adjuvant, and 0.001˜0.01 wt. % of C20H24Na2O10S2 as an adjuvant, while using the pulse rectifier for 500 ms at a temperature of 30 to 70° C., at a current density of 0.01˜1 A/dm2, for 1 to 10 minutes.