US 11,795,325 B2
Curable resin composition and electrical component using the same
Akira Takakura, Kariya (JP); Hiroyuki Okuhira, Kariya (JP); and Katsuhiro Kanie, Kariya (JP)
Assigned to DENSO CORPORATION, Kariya (JP)
Filed by DENSO CORPORATION, Kariya (JP)
Filed on May 28, 2020, as Appl. No. 16/885,710.
Application 16/885,710 is a continuation of application No. PCT/JP2018/042662, filed on Nov. 19, 2018.
Claims priority of application No. 2017-228315 (JP), filed on Nov. 28, 2017.
Prior Publication US 2020/0362166 A1, Nov. 19, 2020
Int. Cl. C08L 75/06 (2006.01); C09J 7/10 (2018.01); C08G 18/62 (2006.01); C08G 18/73 (2006.01); C08G 18/76 (2006.01); C09J 175/04 (2006.01)
CPC C08L 75/06 (2013.01) [C08G 18/6204 (2013.01); C08G 18/6229 (2013.01); C08G 18/73 (2013.01); C08G 18/76 (2013.01); C09J 7/10 (2018.01); C09J 175/04 (2013.01); C08L 2203/16 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A curable resin composition comprising:
a (meth)acrylic polyol;
a hydrogenated polyolefin-based polyol; and
a polyisocyanate,
wherein:
the (meth)acrylic polyol includes a polymer having a hydroxyl value of 5 mg KOH/g or more and 150 mg KOH/g or less, a glass transition temperature of −70° C. or more and −40° C. or less, and a number average molecular weight of 500 or more and 20000 or less, and which is liquid at 25° C.;
the hydrogenated polyolefin-based polyol has an iodine value of 15 or less;
the polyisocyanate includes both a bifunctional polyisocyanate and a trifunctional polyisocyanate; and
when the curable resin composition is cured, it forms urethane bonds and becomes a polyurethane-based cured product.