	US 11,795,294 B2
	Resin composition, resin molded body, and article
Kento Tsuda, Kanagawa (JP); and Akira Yane, Tokyo (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Mar. 24, 2022, as Appl. No. 17/703,799.
Claims priority of application No. 2021-054919 (JP), filed on Mar. 29, 2021.
Prior Publication US 2022/0315734 A1, Oct. 6, 2022
Int. Cl. C08K 3/22 (2006.01); C08K 3/26 (2006.01); C08L 77/00 (2006.01)

CPC C08K 3/22 (2013.01) [C08K 3/26 (2013.01); C08K 2003/2272 (2013.01); C08K 2003/265 (2013.01); C08K 2201/005 (2013.01); C08K 2201/01 (2013.01)]

14 Claims

1. A resin composition comprising:

a resin;

a magnetic powder;

a first non-magnetic powder with a water-soluble content in the range of 0.1% to 0.5%; and

a second non-magnetic powder with a water-soluble content of 0.05% or less.