US 11,795,052 B2
Constraint for a sensor assembly
Jose Fernando Alfaro Perez, Milpitas, CA (US)
Assigned to TE CONNECTIVITY SOLUTIONS GMBH, Schaffhausen (CH)
Filed by Measurement Specialties, Inc., Hampton, VA (US)
Filed on Sep. 29, 2020, as Appl. No. 17/36,659.
Prior Publication US 2022/0098029 A1, Mar. 31, 2022
Int. Cl. B81B 7/00 (2006.01); B81C 1/00 (2006.01); B81B 3/00 (2006.01)
CPC B81B 7/0048 (2013.01) [B81B 2203/019 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A constraint for a sensor assembly, comprising:
a silicon wafer having a first side, a second side opposite to the first side, and a passageway extending through the silicon wafer from the first side to the second side, the first side is a continuous planar surface except for the passageway; and
a flexible structure extending from the second side and aligned with an outermost lateral surface of the silicon wafer in a height direction extending between the first side and the second side of the silicon wafer, the flexible structure includes a plurality of beams and at least one trench disposed between the plurality of beams, a total width of the silicon wafer outside of the passageway in a width direction perpendicular to the height direction is greater than a total width of the beams in the width direction.