CPC B24B 53/005 (2013.01) [B24B 29/04 (2013.01); B24B 37/16 (2013.01)] | 17 Claims |
1. A polishing system, comprising:
a substrate carrier comprising an annular retaining ring configured to surround a to-be-processed substrate during a polishing process; and
a rotatable polishing platen comprising a cylindrical metal body having a pad-mounting surface, wherein
the pad-mounting surface comprises a plurality of polishing zones which include a first zone having a circular or annular shape, a second zone circumscribing the first zone, and a third zone circumscribing the second zone,
at least portions of the pad-mounting surface in the first and third zones define a plane,
the plane is orthogonal to a rotational axis of the polishing platen,
the pad-mounting surface in the second zone is recessed from the plane,
a width of the second zone is less than an outer diameter of the annular retaining ring, and
the pad-mounting surface in the third zone slopes upwardly from the pad-mounting surface in the second zone to intersect a circumferential edge of the platen at an acute angle.
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