US 11,794,286 B2
Copper solder formulation
Michael P. Rowe, Pinckney, MI (US)
Assigned to TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., Plano, TX (US)
Filed by TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., Plano, TX (US)
Filed on Aug. 20, 2020, as Appl. No. 16/998,022.
Prior Publication US 2022/0055158 A1, Feb. 24, 2022
Int. Cl. B23K 35/30 (2006.01); H05B 6/80 (2006.01); B23K 35/36 (2006.01); B23K 1/005 (2006.01)
CPC B23K 35/302 (2013.01) [B23K 1/005 (2013.01); B23K 35/3602 (2013.01); H05B 6/80 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A composition, comprising:
copper(II) oxide powder in the range of 37-53% by mass;
silicon carbide (SiC) powder in the range of 8-14% by mass; and
a flux in the range of 35%-53% by mass, each relative to a total mass of the composition.