US 11,794,003 B2
Nerve cuff electrodes fabricated using over-molded LCP substrates
Siegmar Schmidt, Simi Valley, CA (US); and Boon Khai Ng, La Crescenta, CA (US)
Assigned to THE ALFRED E. MANN FOUNDATION FOR SCIENTIFIC RESEARCH, Valencia, CA (US)
Filed by THE ALFRED E. MANN FOUNDATION FOR SCIENTIFIC RESEARCH, Valencia, CA (US)
Filed on Jun. 4, 2019, as Appl. No. 16/430,785.
Application 16/430,785 is a continuation of application No. 15/634,134, filed on Jun. 27, 2017, abandoned.
Claims priority of provisional application 62/415,028, filed on Oct. 31, 2016.
Prior Publication US 2019/0282805 A1, Sep. 19, 2019
This patent is subject to a terminal disclaimer.
Int. Cl. A61N 1/05 (2006.01); A61N 1/375 (2006.01); A61N 1/36 (2006.01); A61B 5/389 (2021.01)
CPC A61N 1/0556 (2013.01) [A61N 1/3752 (2013.01); A61B 5/389 (2021.01); A61N 1/0558 (2013.01); A61N 1/3605 (2013.01); A61N 1/375 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of constructing a lead connector, comprising:
providing a planar dielectric connector substrate and at least one connector pad carried by the planar dielectric connector substrate; and
affixing the connector substrate around an outer surface of a cylindrical rod, such that the at least one connector pad faces outward away from the cylindrical rod to form at least one lead connector contact, the cylindrical rod being composed of material having the necessary columnar strength to allow the lead connector to be firmly inserted into a corresponding female connector of a neurostimulator without the addition of a supplemental stiffening material.