US 12,453,257 B2
Display substrate, preparation method therefor, and display device
Wei Xia, Beijing (CN); Tao Gao, Beijing (CN); Yuanzheng Guo, Beijing (CN); Huaisen Ren, Beijing (CN); Jie Li, Beijing (CN); and Yongzhan Han, Beijing (CN)
Assigned to Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and Beijing BOE Technology Development Co., Ltd., Beijing (CN)
Appl. No. 17/789,518
Filed by Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Aug. 10, 2021, PCT No. PCT/CN2021/111729
§ 371(c)(1), (2) Date Jun. 28, 2022,
PCT Pub. No. WO2022/062740, PCT Pub. Date Mar. 31, 2022.
Claims priority of application No. 202011020687.7 (CN), filed on Sep. 25, 2020.
Prior Publication US 2023/0040064 A1, Feb. 9, 2023
Int. Cl. H10K 59/131 (2023.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01); H01L 25/18 (2023.01); H10K 59/124 (2023.01); H10K 71/00 (2023.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H10K 59/12 (2023.01); H10K 59/121 (2023.01); H10K 71/80 (2023.01)
CPC H10K 59/131 (2023.02) [H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 25/167 (2013.01); H01L 25/18 (2013.01); H10K 59/124 (2023.02); H10K 71/00 (2023.02); H01L 2224/03002 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05573 (2013.01); H05K 1/181 (2013.01); H05K 3/3426 (2013.01); H10K 59/1201 (2023.02); H10K 59/1213 (2023.02); H10K 71/80 (2023.02)] 16 Claims
OG exemplary drawing
 
1. A display substrate, comprising a display region and a bonding region located on a side of the display region, wherein the bonding region comprises a bonding structure layer disposed on a base substrate, the bonding structure layer comprises a composite insulating layer disposed on the base substrate, the bonding region further comprises a step structure formed by the base substrate and the composite insulating layer, heights of steps in the step structure decrease sequentially in a direction away from the display region, and the base substrate is provided with a first step having a smallest height in the step structure; and
the bonding structure layer further comprises a signal connection line, at least a portion of the signal connection line is disposed on the step structure and located on the first step, the base substrate at the first step is provided with an opening exposing the signal connection line, and a portion of the signal connection line exposed by the opening is provided with a bonding pin.