US 12,453,225 B2
Light emitting diode packaging structure
Chih-Hao Lin, Hsinchu (TW); Jo-Hsiang Chen, Hsinchu (TW); Shih-Lun Lai, Hsinchu (TW); Min-Che Tsai, Hsinchu (TW); and Jian-Chin Liang, Hsinchu (TW)
Assigned to Lextar Electronics Corporation, Hsinchu (TW)
Filed by Lextar Electronics Corporation, Hsinchu (TW)
Filed on Feb. 27, 2024, as Appl. No. 18/587,974.
Application 17/653,462 is a division of application No. 16/944,131, filed on Jul. 30, 2020, granted, now 11,296,269, issued on Apr. 5, 2022.
Application 18/587,974 is a continuation of application No. 18/303,578, filed on Apr. 20, 2023, granted, now 11,949,056.
Application 18/303,578 is a continuation of application No. 17/653,462, filed on Mar. 3, 2022, granted, now 11,670,749, issued on Jun. 6, 2023.
Prior Publication US 2024/0194848 A1, Jun. 13, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H10H 20/857 (2025.01); H10H 20/01 (2025.01); H10H 20/855 (2025.01)
CPC H10H 20/857 (2025.01) [H10H 20/01 (2025.01); H10H 20/855 (2025.01); H10H 20/0363 (2025.01); H10H 20/0364 (2025.01)] 8 Claims
OG exemplary drawing
 
1. A light emitting diode packaging structure, comprising:
a flexible substrate, wherein a bottom surface of the flexible substrate is an even surface or an uneven surface;
a plurality of micro light emitting elements disposed on the flexible substrate, wherein the plurality of micro light emitting elements have a first surface facing to the flexible substrate and a second surface opposite to the first surface, and the plurality of micro light emitting elements comprise a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element;
a conductive pad disposed on the second surface of the micro light emitting elements;
a redistribution layer covering the micro light emitting elements and the conductive pad, wherein the redistribution layer comprises an insulating layer and a circuit layer embedded in the insulating layer, and the circuit layer is electrically connected to the conductive pad;
an electrode pad disposed on the redistribution layer and electrically connecting to the circuit layer; and
a carrier substrate disposed on a bottom surface of the flexible substrate.