US 12,453,224 B2
Led display substrate and method for manufacturing the same, display panel
Ting Zeng, Beijing (CN); Xinhong Lu, Beijing (CN); Heren Gui, Beijing (CN); Jian Yang, Beijing (CN); and Yongfei Li, Beijing (CN)
Assigned to Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui (CN); and Beijing BOE Technology Development Co., Ltd., Beijing (CN)
Appl. No. 17/775,959
Filed by Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed May 20, 2021, PCT No. PCT/CN2021/094849
§ 371(c)(1), (2) Date May 11, 2022,
PCT Pub. No. WO2022/001462, PCT Pub. Date Jan. 6, 2022.
Claims priority of application No. 202010621459.9 (CN), filed on Jun. 30, 2020.
Prior Publication US 2022/0393087 A1, Dec. 8, 2022
Int. Cl. H10H 20/857 (2025.01); H10H 20/01 (2025.01); H10H 20/84 (2025.01)
CPC H10H 20/857 (2025.01) [H10H 20/01 (2025.01); H10H 20/84 (2025.01); H10H 20/034 (2025.01); H10H 20/0364 (2025.01)] 18 Claims
OG exemplary drawing
 
1. An LED display substrate, comprising:
a base substrate comprising a display area and a bonding area;
a first metal conductive layer pattern located on the base substrate and comprising a plurality of signal wires;
a first passivation layer located on a side of the first metal conductive layer pattern away from the base substrate;
a second metal conductive layer pattern located on a side of the first passivation layer away from the base substrate and comprising a first connection terminal and a second connection terminal which are respectively connected with a corresponding signal wire pattern through a via hole;
a second passivation layer located on a side of the second metal conductive layer pattern away from the base substrate; wherein
a first blackening layer pattern is provided between the first metal conductive layer pattern and the first passivation layer, and an orthographic projection of the first blackening layer pattern on the base substrate is located in an area where an orthographic projection of the first metal conductive layer pattern on the base substrate is located;
and/or a second blackening layer pattern is provided between the second metal conductive layer pattern and the second passivation layer, and an orthographic projection of the second blackening layer pattern on the base substrate is located in an area where an orthographic projection of the second metal conductive layer pattern on the base substrate is located, and wherein
the first connection terminal comprises a first actual connection region, and the orthographic projection of the second blackening layer pattern on the base substrate and an orthographic projection of a portion of the second metal conductive layer pattern except the first actual connection region on the base substrate completely coincide; and
a protective pattern is provided on a side of the second connection terminal away from the base substrate and at side surfaces of the second connection terminal, a material of the protective pattern is a metal oxide conductive material, and a portion of the second blackening layer pattern covering the second connection terminal is located between the protective pattern and the second connection terminal.