US 12,453,222 B2
Light emitting device and manufacturing method thereof
Ming-Chang Lin, Miao-Li County (TW)
Assigned to Innolux Corporation, Miao-Li County (TW)
Filed by Innolux Corporation, Miao-Li County (TW)
Filed on Dec. 7, 2021, as Appl. No. 17/543,747.
Claims priority of application No. 202110004695.0 (CN), filed on Jan. 4, 2021.
Prior Publication US 2022/0216383 A1, Jul. 7, 2022
Int. Cl. H10H 20/857 (2025.01); H10H 20/01 (2025.01)
CPC H10H 20/857 (2025.01) [H10H 20/01 (2025.01); H10H 20/0364 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A method for manufacturing a light emitting device comprising:
providing a substrate;
forming a first bonding layer on the substrate;
forming a first passivation layer on the first bonding layer;
providing a light emitting element;
forming a second bonding layer on the light emitting element;
forming a second passivation layer on the second bonding layer;
contacting the second passivation layer on the light emitting element with the first passivation layer on the substrate to form a third bonding layer between the substrate and the light emitting element and to bond the light emitting element to the substrate,
wherein a material of the third bonding layer is composed of a material of the first bonding layer and a material of the second bonding layer,
wherein a material of the first passivation layer and a material of the second passivation layer are a pure metal material.