US 12,453,198 B2
Imaging apparatus
Takayoshi Yamada, Hyogo (JP); and Yoshihiro Sato, Osaka (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed on Feb. 24, 2023, as Appl. No. 18/174,601.
Application 18/174,601 is a continuation of application No. PCT/JP2021/033481, filed on Sep. 13, 2021.
Claims priority of application No. 2020-156104 (JP), filed on Sep. 17, 2020.
Prior Publication US 2023/0223411 A1, Jul. 13, 2023
Int. Cl. H10F 39/00 (2025.01); H10F 39/18 (2025.01)
CPC H10F 39/802 (2025.01) [H10F 39/18 (2025.01); H10F 39/807 (2025.01); H10F 39/811 (2025.01)] 20 Claims
OG exemplary drawing
 
1. An imaging apparatus comprising:
a pixel region including a first semiconductor substrate section and pixels; and
a peripheral region including a second semiconductor substrate section and no pixels, wherein:
the first semiconductor substrate section and the second semiconductor substrate section are mutually different portions of a single semiconductor substrate in a plan view,
the single semiconductor substrate includes a top surface and a bottom surface opposite to the top surface,
each of the pixels includes:
a first electrode;
a second electrode;
a photoelectric conversion layer that is disposed between the first electrode and the second electrode; and
a charge accumulation region disposed in the first semiconductor substrate section,
the pixel region includes:
first through-holes that penetrate the first semiconductor substrate section from the top surface to the bottom surface of the single semiconductor substrate; and
first penetrating electrodes, each of the first penetrating electrodes being disposed in a corresponding first through-hole of the first through-holes and electrically connecting the first electrode to the charge accumulation region,
the peripheral region includes:
second through-holes that penetrate the second semiconductor substrate section from the top surface to the bottom surface of the single semiconductor substrate; and
second penetrating electrodes, each of the second penetrating electrodes being disposed in a corresponding second through-hole of the second through-holes, and
an areal density of the first penetrating electrodes that is a ratio of an area of the first penetrating electrodes to an area of the pixel region is different from an areal density of the second penetrating electrodes that is a ratio of an area of the second penetrating electrodes to an area of the peripheral region.