| CPC H10D 30/6755 (2025.01) [H10D 30/031 (2025.01)] | 8 Claims |

|
1. A semiconductor device comprising:
a substrate;
a first conductor over the substrate;
a first metal oxide over the first conductor;
a first oxide over and in contact with the first metal oxide;
a second oxide over the first oxide;
a first insulator over the second oxide;
a second conductor over the first insulator;
a second insulator over the second conductor;
a third insulator in contact with a side surface of the second conductor, a side surface of the first insulator, and a side surface of the second insulator;
a second metal oxide over the second oxide, the second insulator, and the third insulator; and
a third conductor over the second metal oxide, the third conductor being in contact with a top surface of the second metal oxide,
wherein the second conductor comprises a region overlapping with the second oxide,
wherein the third conductor comprises a region in contact with the second metal oxide,
wherein the second metal oxide comprises a region in contact with the second oxide,
wherein a carrier concentration of the second oxide is lower than a carrier concentration of the first oxide,
wherein a carrier concentration of the first metal oxide is higher than the carrier concentration of the first oxide, and
wherein a carrier concentration of the second metal oxide is higher than the carrier concentration of the first oxide.
|