US 12,453,067 B2
Component supply device
Yoshinori Isobata, Fukuoka (JP); Atuyuki Horie, Fukuoka (JP); and Kyourei Ri, Fukuoka (JP)
Assigned to Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed on Nov. 10, 2022, as Appl. No. 18/054,179.
Claims priority of application No. 2021-186734 (JP), filed on Nov. 17, 2021.
Prior Publication US 2023/0156990 A1, May 18, 2023
Int. Cl. H05K 13/02 (2006.01)
CPC H05K 13/02 (2013.01) 11 Claims
OG exemplary drawing
 
1. A component supply device that supplies a component to a component supply position using a component supply tape including a base tape and a cover tape, the base tape having a storage part storing the component, the cover tape being attached to the base tape to cover the storage part, the component supply device comprising:
a conveyance path leading from an introduction position of the component supply tape to the component supply position;
a conveyance mechanism that conveys the component supply tape on the conveyance path to the component supply position;
a first rotation body;
a second rotation body coming into contact with the first rotation body to rotate together with the first rotation body; and
a third rotation body that comes into contact with the first rotation body to rotate together with the first rotation body, wherein
the first rotation body and the second rotation body are provided upstream of the component supply position, sandwich the cover tape to peel the cover tape from the base tape, and rotate, and
the first rotation body and the third rotation body sandwich and feed the cover tape fed out by the first rotation body and the second rotation body.