US 12,453,066 B2
Electromagnetic wave shielding material, electronic component, and electronic apparatus
Tatsuo Mikami, Minamiashigara (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Nov. 29, 2023, as Appl. No. 18/523,491.
Application 18/523,491 is a continuation of application No. PCT/JP2022/019489, filed on May 2, 2022.
Claims priority of application No. 2021-091631 (JP), filed on May 31, 2021.
Prior Publication US 2024/0107728 A1, Mar. 28, 2024
Int. Cl. H05K 9/00 (2006.01); B32B 3/08 (2006.01); B32B 7/025 (2019.01); B32B 7/12 (2006.01); H01F 1/26 (2006.01); B32B 15/08 (2006.01)
CPC H05K 9/0084 (2013.01) [B32B 3/08 (2013.01); B32B 7/025 (2019.01); B32B 7/12 (2013.01); H01F 1/26 (2013.01); B32B 15/08 (2013.01); B32B 2307/212 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An electromagnetic wave shielding material comprising:
a multilayer structure having a magnetic layer containing magnetic particles, between two metal layers,
wherein a part or whole of an edge surface of the magnetic layer is coated with a coating material, and
a part or whole of the coating material is a coating material having a thermal conductivity higher than a thermal conductivity of the magnetic layer.