US 12,453,060 B2
Two phase immersion cooling system with useable warmed liquid output
Linh M. Le, Portland, OR (US); Ra'anan Sover, Tirat Carmel (IL); Alexey Chinkov, Haifa (IL); James D. Williams, Portland, OR (US); Paul C. George, Beaverton, OR (US); and Paul J. Gwin, Orangevale, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 20, 2021, as Appl. No. 17/556,763.
Claims priority of provisional application 63/148,405, filed on Feb. 11, 2021.
Prior Publication US 2022/0256744 A1, Aug. 11, 2022
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20836 (2013.01) [H05K 7/203 (2013.01); H05K 7/20318 (2013.01); H05K 7/20327 (2013.01); H05K 7/20818 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
memory;
machine-readable instructions; and
at least one processor circuit to be programmed by the machine-readable instructions to:
cause a volume of an ambient of a two phase immersion cooling system to increase in response to a first temperature of a fluid approaching a first lower limit, the ambient including a condenser that is to emit the fluid warmed by vapor in the ambient, the vapor to be generated by heat, the heat to be generated by electronic devices immersed in a liquid bath; and
cause the volume to decrease in response to a second temperature of the fluid approaching a second higher limit.