US 12,453,058 B2
Heat dissipation structure and electronic device including same
Taewook Ham, Suwon-si (KR); Moonhyung Kwon, Suwon-si (KR); Min Park, Suwon-si (KR); Younggirl Yun, Suwon-si (KR); and Taekkyun Choi, Suwon-si (KR)
Assigned to Samsung Electronic Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 19, 2023, as Appl. No. 18/303,284.
Application 18/303,284 is a continuation of application No. PCT/KR2021/017192, filed on Nov. 22, 2021.
Claims priority of application No. 10-2020-0157830 (KR), filed on Nov. 23, 2020.
Prior Publication US 2023/0262940 A1, Aug. 17, 2023
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20481 (2013.01) [G06F 1/203 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a bracket;
a circuit board disposed below the bracket;
at least one electronic element disposed on one surface of the circuit board facing the bracket;
a shield can mounted on the one surface of the circuit board and covering at least part of the electronic element and comprising at least one opening formed in an area corresponding to the electronic element;
a heat diffusion structure disposed between the bracket and the shield can, configured to close the at least one opening and in contact with the bracket; and
a heat transfer member disposed between and in contact with the electronic element and the heat diffusion structure and at least partially located in the at least one opening,
wherein the heat diffusion structure comprises:
a heat dissipation member in contact with the heat transfer member; and
a shield including a first sheet portion disposed between the bracket and the heat dissipation member, and a second sheet portion extending from the first sheet portion and surrounding at least a part of the heat dissipation member, the shield forming a structure that surrounds the electronic element together with the shield can.