US 12,453,057 B2
Thermal management for head mounted wearable device
Joshua Moore, Elora (CA); and Emil Rahim, San Jose, CA (US)
Assigned to Google LLC, Mountain View, CA (US)
Appl. No. 18/249,929
Filed by Google LLC, Mountain View, CA (US)
PCT Filed Aug. 19, 2022, PCT No. PCT/US2022/075211
§ 371(c)(1), (2) Date Apr. 20, 2023,
PCT Pub. No. WO2024/039405, PCT Pub. Date Feb. 22, 2024.
Prior Publication US 2024/0244798 A1, Jul. 18, 2024
Int. Cl. H05K 7/20 (2006.01); G02B 27/01 (2006.01); G06F 1/16 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20481 (2013.01) [G02B 27/0176 (2013.01); G06F 1/163 (2013.01); G06F 1/203 (2013.01); G02B 2027/0178 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A wearable computing device, comprising:
a frame; and
an enclosure formed by a portion of the frame, the enclosure defining an interior space, the enclosure including:
a first layer adjacent an interior of the enclosure;
a second layer adjacent the first layer; and
an intermediate layer positioned between the first layer and the second layer, the intermediate layer including:
a first section including a first material having thermal properties configured to spread heat generated by at least one heat generating component installed in the interior space in the enclosure; and
a second section including a second material having thermal properties configured to inhibit further spreading of heat through the enclosure.