US 12,453,056 B2
Foldable electronic device comprising heat-dissipating structure
Jaeyoung Huh, Suwon-si (KR); Jonghoon Lim, Suwon-si (KR); Ohhyuck Kwon, Suwon-si (KR); Ahreum Hwang, Suwon-si (KR); and Sungchul Park, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Appl. No. 18/039,656
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
PCT Filed Apr. 13, 2021, PCT No. PCT/KR2021/004670
§ 371(c)(1), (2) Date May 31, 2023,
PCT Pub. No. WO2021/235700, PCT Pub. Date Nov. 25, 2021.
Claims priority of application No. 10-2020-0059305 (KR), filed on May 18, 2020.
Prior Publication US 2023/0422448 A1, Dec. 28, 2023
Int. Cl. H05K 7/20 (2006.01); G06F 1/16 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20481 (2013.01) [G06F 1/1652 (2013.01); G06F 1/1681 (2013.01); G06F 1/203 (2013.01); G06F 2200/203 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A foldable electronic device comprising:
a housing including a first housing portion, a second housing portion, and a hinge housing portion at least partially disposed between the first housing portion and the second housing portion;
a hinge module accommodated in the housing and coupled with the first housing portion and the second housing portion;
a flexible display accommodated in the first housing portion and the second housing portion;
a first PCB accommodated in the first housing portion;
a second PCB accommodated in the second housing portion;
a flexible printed circuit board (FPCB) at least partially disposed between the hinge housing portion and the flexible display, and electrically connected between the first PCB and the second PCB; and
a heat transfer sheet including a first portion attached with the FPCB and a second portion configured to receive heat from a first component at the first PCB, and at least partially disposed between the hinge housing portion and the flexible display,
wherein heat from the first component at the first PCB is at least partially transferred to the second housing portion via the heat transfer sheet.