US 12,453,054 B2
Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass
Phil Geng, Washougal, WA (US); Ralph V. Miele, Hillsboro, OR (US); David Shia, Portland, OR (US); Sandeep Ahuja, Portland, OR (US); and Jeffory L. Smalley, Olympia, WA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Feb. 18, 2022, as Appl. No. 17/676,100.
Prior Publication US 2022/0174843 A1, Jun. 2, 2022
Int. Cl. H05K 7/20 (2006.01); H05K 7/14 (2006.01)
CPC H05K 7/20409 (2013.01) [H05K 7/1489 (2013.01); H05K 7/20727 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a bolster plate including:
a first fixturing element; and
a strap, the strap positioned along a frame arm of the bolster plate, the strap including a second fixturing element to be fixed to a cooling mass, the strap to diminish movement of the cooling mass along a first dimension along a length of the frame arm and a second dimension that is orthogonal to the first dimension, a semiconductor chip package to be placed in a window opening defined by the bolster plate's frame arms, the cooling mass to be thermally coupled to the semiconductor chip package;
a first fastener to couple a first end of the strap to the bolster plate; and
a second fastener to couple a second end of the strap to the bolster plate.