US 12,453,046 B2
Systems for thermal management of an electronic device
Jingyuan Liang, Toronto (CA); Andrei Catuneanu, Oakville (CA); and Matthew S. Birkett, Toronto (CA)
Assigned to DANA CANADA CORPORATION, Oakville (CA)
Filed by Dana Canada Corporation, Oakville (CA)
Filed on Oct. 19, 2022, as Appl. No. 18/047,860.
Prior Publication US 2024/0138107 A1, Apr. 25, 2024
Prior Publication US 2024/0237280 A9, Jul. 11, 2024
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01)
CPC H05K 7/20272 (2013.01) [H05K 1/0201 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system, comprising:
a metallic plate;
a printed-circuit-board (PCB) including embedded integrated circuits, wherein the PCB is mounted on a first side of the metallic plate;
a dielectric isolation layer separating the PCB from the metallic plate and directly coupled to and in face-sharing contact with the PCB and the metallic plate, wherein the dielectric isolation layer is positioned to be between the embedded integrated circuits and the metallic plate; and
a semi-open coolant manifold directly mounted to a second side of the metallic plate, the second side opposite the first side.