US 12,453,043 B2
Mechanically expanded microfin tube liquid cooled heat sink
Arindom Joardar, Jamesville, NY (US); Lokanath Mohanta, Liverpool, NY (US); Konstantin Borisov, Avon, CT (US); and Ismail Agirman, Southington, CT (US)
Assigned to CARRIER CORPORATION, Palm Beach Gardens, FL (US)
Filed by Carrier Corporation, Palm Beach Gardens, FL (US)
Filed on Nov. 2, 2022, as Appl. No. 18/051,977.
Claims priority of provisional application 63/274,587, filed on Nov. 2, 2021.
Prior Publication US 2023/0292464 A1, Sep. 14, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20263 (2013.01) [H05K 7/2089 (2013.01); H05K 7/209 (2013.01); H05K 7/20927 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method of forming a power electronics assembly, comprising:
forming a plurality of pathway openings in a heat exchanger body;
inserting a tubular member in each pathway opening of the plurality of pathway openings, the tubular member including a plurality of internal surface enhancements;
defining an interference fit between the tubular members and the heat exchanger body via mechanical expansion of the tubular members to define a plurality of fluid pathways in the heat exchanger body; and
installing one or more power electronics devices to the heat exchanger body;
wherein the plurality of internal surface enhancements are formed simultaneously with the mechanical expansion of the tubular members in the heat exchanger body;
wherein the mechanical expansion of the tubular members to define the interference fit and the forming of the plurality of internal surface enhancements is performed via insertion of an expansion bullet into an interior of each tubular member of the plurality of tubular members.