US 12,453,042 B2
Metallic thermal interface materials and associated devices, systems, and methods
Himanshu Pokharna, Saratoga, CA (US)
Assigned to DEEIA INC., Saratoga, CA (US)
Filed by DEEIA INC., Saratoga, CA (US)
Filed on Dec. 23, 2024, as Appl. No. 19/000,555.
Application 19/000,555 is a continuation in part of application No. PCT/US2024/016585, filed on Feb. 20, 2024.
Application 19/000,555 is a continuation in part of application No. 18/212,623, filed on Jun. 21, 2023.
Application 19/000,555 is a continuation in part of application No. PCT/US2022/039196, filed on Aug. 2, 2022.
Application 19/000,555 is a continuation in part of application No. PCT/US2023/025894, filed on Jun. 21, 2023.
Application PCT/US2023/025894 is a continuation in part of application No. 17/879,630, filed on Aug. 2, 2022, granted, now 12,004,324, issued on Jun. 4, 2024.
Application 19/000,555 is a continuation in part of application No. 18/212,623, filed on Jun. 21, 2023.
Application 18/212,623 is a continuation in part of application No. 17/879,630, filed on Aug. 2, 2022, granted, now 12,004,324, issued on Jun. 4, 2024.
Claims priority of provisional application 63/485,925, filed on Feb. 19, 2023.
Claims priority of provisional application 63/354,175, filed on Jun. 21, 2022.
Prior Publication US 2025/0126746 A1, Apr. 17, 2025
Int. Cl. G06F 1/20 (2006.01); C09K 5/06 (2006.01); H01M 10/613 (2014.01); H01M 10/653 (2014.01); H01M 10/6551 (2014.01); H01M 10/6567 (2014.01); H05K 7/20 (2006.01)
CPC H05K 7/20254 (2013.01) [C09K 5/06 (2013.01); G06F 1/20 (2013.01); H01M 10/613 (2015.04); H01M 10/653 (2015.04); H01M 10/6551 (2015.04); H01M 10/6567 (2015.04); H05K 7/20263 (2013.01); G06F 2200/201 (2013.01)] 82 Claims
OG exemplary drawing
 
1. A heat-transfer component, comprising:
a thermal-interface surface; and
a composite thermal-interface material comprising a metallic carrier material and a particulate filler, wherein the particulate filler comprises a coating or plating material and a particulate material, wherein the coating or plating material at least partly envelopes the particulate material, and wherein the coating or plating material has higher wettability by the metallic carrier material than the particulate material, the composite thermal-interface material bonded to the thermal-interface surface, wherein the metallic carrier material begins to melt at a temperature between about 15° C. and about 40° C.