US 12,453,038 B2
Electronic device and airflow generating package
Chiung C. Lo, San Jose, CA (US); Wen-Chien Chen, New Taipei (TW); and Chun-I Chang, Hsinchu County (TW)
Assigned to xMEMS Labs, Inc., Santa Clara, CA (US)
Filed by xMEMS Labs, Inc., Santa Clara, CA (US)
Filed on Jan. 2, 2025, as Appl. No. 19/007,559.
Claims priority of provisional application 63/664,713, filed on Jun. 26, 2024.
Claims priority of provisional application 63/618,391, filed on Jan. 8, 2024.
Prior Publication US 2025/0227874 A1, Jul. 10, 2025
Int. Cl. H05K 7/20 (2006.01); H10N 30/20 (2023.01); H10N 30/88 (2023.01); H10N 39/00 (2023.01)
CPC H05K 7/20154 (2013.01) [H10N 30/2047 (2023.02); H10N 30/88 (2023.02); H10N 39/00 (2023.02)] 29 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
an operational component, wherein the operational component produces a heat while operating;
a heat conductive component configured to conduct the heat generated by the operational component, wherein the operational component is disposed on the heat conductive component; and
an airflow generating package disposed by an edge of the electronic device;
wherein the airflow generating package comprises a covering structure, a film structure and a base, and the film structure is disposed between the base and the covering structure;
wherein the film structure operates at an ultrasonic rate to produce an airflow;
wherein the heat conductive component extends toward the airflow generating package, such that the airflow generated by the airflow generating package flows through the heat conductive component, so as to dissipate the heat generated from the operational component through the heat conductive component;
wherein the covering structure is disposed between the heat conductive component and the film structure.