US 12,453,030 B2
Load distributing frame for heat sink applications
Mitchell O'Leary, Ottawa (CA); Bonnie L. Mack, Carp (CA); and Trevor Meunier, Kemptville (CA)
Assigned to Ciena Corporation, Hanover, MD (US)
Filed by Ciena Corporation, Hanover, MD (US)
Filed on Apr. 23, 2024, as Appl. No. 18/643,385.
Application 18/643,385 is a continuation of application No. 17/545,025, filed on Dec. 8, 2021, granted, now 11,997,817.
Prior Publication US 2024/0276668 A1, Aug. 15, 2024
Int. Cl. H05K 7/14 (2006.01)
CPC H05K 7/142 (2013.01) [H05K 7/1427 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A module comprising:
a printed circuit board (PCB);
a device requiring a heatsink disposed on the PCB; and
a support structure coupled to the PCB, wherein the support structure defines a plurality of mounting points located along the support structure on a side facing the device, wherein the plurality of mounting points receive a plurality of screws and springs that secure at least one frame to the support structure, and wherein the at least one frame is used to apply pressure to the heat sink and compress the heat sink onto the device.