US 12,453,018 B2
Vibration damped electronics assemblies for process variable transmitters
Jacob Daniel Holm, Savage, MN (US); George Charles Hausler, Maple Grove, MN (US); and Andrew John Wagener, Maple Grove, MN (US)
Assigned to Rosemount Inc., Shakopee, MN (US)
Filed by Rosemount Inc., Shakopee, MN (US)
Filed on Nov. 30, 2022, as Appl. No. 18/071,788.
Prior Publication US 2024/0179854 A1, May 30, 2024
Int. Cl. H05K 5/00 (2025.01); H05K 5/02 (2006.01); H05K 7/14 (2006.01)
CPC H05K 5/0056 (2013.01) [H05K 5/0217 (2013.01); H05K 7/1417 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A process variable transmitter for use in an industrial process, comprising:
a housing;
a process variable sensor configured to sense a process variable of the industrial process;
a first electronics board in the housing including a microprocessor electrically coupled to the process variable sensor and configured to receive the sensed process variable;
a second electronics board in the housing comprising a local interface electrically coupled to the microprocessor and configured to communicate information related to the sensed process variable;
a spring loaded electrical interconnection which electrically couples the first electronics board to the second electronics board;
a shroud that holds and contains the second electronics board;
at least one elastomeric stop feature positioned between the shroud and the second electronics board to provide vibration damping to the electronics board to maintain the electrical interconnection between the second electronics board and the first electronics board, and
a locking mechanism which urges the second electronics board against the at least one elastomeric stop feature, wherein the spring loaded electrical interconnection, locking mechanism and at least one elastomeric stop feature provides for limited motion of the second electronics board while absorbing and damping external shocks and vibrations.