US 12,453,013 B2
Method for producing wiring circuit board and wiring circuit board
Kenta Fukushima, Osaka (JP); Hayato Takakura, Osaka (JP); Naoki Shibata, Osaka (JP); and Ryosuke Sasaoka, Osaka (JP)
Assigned to NITTO DENKO CORPORATION, Osaka (JP)
Filed by NITTO DENKO CORPORATION, Osaka (JP)
Filed on Sep. 20, 2023, as Appl. No. 18/471,046.
Claims priority of application No. 2022-152343 (JP), filed on Sep. 26, 2022.
Prior Publication US 2024/0114628 A1, Apr. 4, 2024
Int. Cl. H05K 3/10 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 3/00 (2006.01); H05K 3/32 (2006.01)
CPC H05K 3/103 (2013.01) [H05K 1/0296 (2013.01); H05K 3/0017 (2013.01); H05K 3/32 (2013.01); H05K 2201/10287 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for producing a wiring circuit board comprising:
a preparation step of preparing a substrate;
a first patterning step of forming an insulating layer on one side of the substrate in a thickness direction;
a second patterning step of forming a conductive pattern on one side of the insulating layer in the thickness direction, the conductive pattern having a first terminal, a second terminal, a first wiring connected to the first terminal, and a second wiring connected to the second terminal and disposed spaced from the first wiring; and
a deposition step of depositing a metal on the other side of the substrate in the thickness direction to form a first metal support layer having a terminal support portion supporting the first terminal and the second terminal, a first wiring support portion supporting the first wiring, and a second wiring support portion supporting the second wiring and disposed spaced from the first wiring support portion.