US 12,453,012 B2
Printed circuit board and method of manufacturing the same
Do Jae Yoo, Suwon-si (KR); Yong Gil Namgung, Suwon-si (KR); Jong Hoon Shin, Suwon-si (KR); Won Ju Jang, Suwon-si (KR); and Yun Hwan Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Jan. 27, 2023, as Appl. No. 18/102,285.
Claims priority of application No. 10-2022-0088934 (KR), filed on Jul. 19, 2022.
Prior Publication US 2024/0032201 A1, Jan. 25, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01)
CPC H05K 1/185 (2013.01) [H05K 1/0296 (2013.01); H05K 1/0306 (2013.01); H05K 1/053 (2013.01); H05K 3/10 (2013.01); H05K 2201/0206 (2013.01); H05K 2203/013 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A printed circuit board (PCB) comprising:
a solder resist layer including at least one of an opening and a depression, wherein the opening and the depression each are recessed from a portion of an upper surface of the solder resist layer towards a lower surface of the solder resist layer such that the upper surface and each of the opening and the depression have an edge; and
a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression,
wherein the portion of the upper surface of the solder resist layer is exposed from the solder resist patch.