US 12,453,005 B1
Laminated unit for printed circuit board and printed circuit board
Chuansheng Cheng, Beijing (CN); Dayong Shen, Beijing (CN); and Jian Wang, Beijing (CN)
Assigned to Beijing Zitiao Network Technology Co., Ltd., Beijing (CN)
Filed by Beijing Zitiao Network Technology Co., Ltd., Beijing (CN)
Filed on Dec. 26, 2024, as Appl. No. 19/002,547.
Claims priority of application No. 202410405267.2 (CN), filed on Apr. 3, 2024.
Int. Cl. H05K 1/02 (2006.01); H05K 1/03 (2006.01)
CPC H05K 1/0366 (2013.01) [H05K 2201/0183 (2013.01); H05K 2201/029 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/09309 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A laminated unit for a printed circuit board, comprising: a plurality of metal layers and a plurality of dielectric layers alternately stacked in a thickness direction,
wherein the plurality of metal layers comprise a signal transmission layer and a pair of reference layers disposed on two sides of the signal transmission layer;
at least one of two dielectric layers adjacent to the signal transmission layer comprises a resin isolation layer; and
dielectric layers on sides of the pair of reference layers opposite to the signal transmission layer comprise a reinforcing layer, and the reinforcing layer comprises a substrate and a resin material arranged around the substrate,
wherein one of the two dielectric layers adjacent to the signal transmission layer comprises the resin isolation layer, and the other dielectric layer comprises the reinforcing layer.