US 12,452,992 B2
Power module having reduced intrinsic inductance
Christoph Bauer, Regensburg (DE); and Peter Weiss, Regensburg (DE)
Assigned to AVL Software and Functions GmbH, Regensburg (DE)
Filed by AVL Software and Functions GmbH, Regensburg (DE)
Filed on Apr. 29, 2024, as Appl. No. 18/648,649.
Application 18/648,649 is a continuation of application No. 17/590,980, filed on Feb. 2, 2022, abandoned.
Claims priority of application No. 102021102924.4 (DE), filed on Feb. 9, 2021.
Prior Publication US 2024/0276633 A1, Aug. 15, 2024
Int. Cl. H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/0213 (2013.01) [H05K 1/181 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A power module having reduced intrinsic inductance, comprising:
an at least partially electrically insulating layer that has a first surface on which a power electronics unit is arranged and a second surface which is opposite the first surface; and
a compensation layer is arranged on the second surface; wherein:
the compensation layer is electrically conductive and electrically connected to an electric potential of the power electronics unit; and
the compensation layer is divided into a plurality of portions, these portions being electrically insulated from one another and to allow different electric potentials, the different electric potentials having opposite polarity signs, to be applied to these portions.