US 12,452,990 B2
Composite heat dissipation structure and display apparatus
Wei Wang, Beijing (CN)
Assigned to Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and Beijing BOE Technology Development Co., Ltd., Beijing (CN)
Appl. No. 18/022,262
Filed by Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed May 19, 2022, PCT No. PCT/CN2022/093903
§ 371(c)(1), (2) Date Feb. 20, 2023,
PCT Pub. No. WO2023/221045, PCT Pub. Date Nov. 23, 2023.
Prior Publication US 2024/0276631 A1, Aug. 15, 2024
Int. Cl. H05K 1/02 (2006.01); H01Q 1/02 (2006.01); H01Q 1/38 (2006.01); H05K 1/16 (2006.01)
CPC H05K 1/0201 (2013.01) [H01Q 1/02 (2013.01); H01Q 1/38 (2013.01); H05K 1/028 (2013.01); H05K 1/16 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10128 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A composite heat dissipation structure, comprising:
a grid tape, a buffer layer, and a ferrite layer that are stacked in sequence, and
a flexible printed circuit board arranged at a side of the ferrite layer facing the grid tape,
wherein the flexible printed circuit board comprises:
a substrate, and
a conductive layer on at least one side of the substrate,
wherein the conductive layer is provided with:
a heat dissipation pattern, and
a communication antenna pattern,
wherein an orthographic projection of the heat dissipation pattern on the substrate and an orthographic projection of the communication antenna pattern on the substrate do not overlap each other.