US 12,452,514 B2
Camera module having image sensor located between first and second circuit boards
Jae Keun Park, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Filed by LG INNOTEK CO., LTD., Seoul (KR)
Filed on Apr. 21, 2023, as Appl. No. 18/304,983.
Application 18/304,983 is a continuation of application No. 17/561,266, filed on Dec. 23, 2021, granted, now 11,665,421.
Application 17/561,266 is a continuation of application No. 17/081,424, filed on Oct. 27, 2020, granted, now 11,240,414, issued on Feb. 1, 2022.
Application 17/081,424 is a continuation of application No. 16/097,184, granted, now 10,848,657, issued on Nov. 24, 2020, previously published as PCT/KR2017/004573, filed on Apr. 28, 2017.
Claims priority of application No. 10-2016-0052784 (KR), filed on Apr. 29, 2016; application No. 10-2016-0060304 (KR), filed on May 17, 2016; and application No. 10-2017-0009288 (KR), filed on Jan. 19, 2017.
Prior Publication US 2023/0254566 A1, Aug. 10, 2023
Int. Cl. H04N 23/57 (2023.01); G02B 5/20 (2006.01); G02B 7/00 (2021.01); G02B 7/02 (2021.01); G02B 7/08 (2021.01); G02B 7/09 (2021.01); G02B 13/00 (2006.01); G02B 27/64 (2006.01); G03B 5/00 (2021.01); G03B 11/00 (2021.01); G03B 13/36 (2021.01); H01L 23/498 (2006.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H05K 1/14 (2006.01); H10F 39/00 (2025.01)
CPC H04N 23/57 (2023.01) [G02B 7/004 (2013.01); G02B 7/08 (2013.01); G02B 7/09 (2013.01); G02B 13/001 (2013.01); G02B 27/646 (2013.01); G03B 5/00 (2013.01); G03B 11/00 (2013.01); G03B 13/36 (2013.01); H01L 23/498 (2013.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H05K 1/144 (2013.01); H05K 1/147 (2013.01); H10F 39/804 (2025.01); H10F 39/806 (2025.01); H10F 39/811 (2025.01); G02B 5/208 (2013.01); G02B 7/021 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A camera module comprising:
a first circuit board comprising a first through hole;
a second circuit board disposed below the first circuit board and comprising a second through hole which is opposite to the first through hole;
an image sensor disposed in the second through hole of the second circuit board so as to be spaced apart from the second circuit board;
a filter disposed above the image sensor; and
a plate shaped member directly coupled to a lower surface of the second circuit board and configured to close the second hole of the second circuit board,
wherein the plate shape member is formed of a metallic material and is disposed under the second circuit board and the image sensor, the plate shape member being spaced apart from the image sensor,
wherein an upper surface of the plate shaped member does not contact the image sensor, and the image sensor does not contact the second circuit board,
wherein a lower surface of the first circuit board is coupled to an upper surface of the second circuit board by a first conductive adhesive,
wherein an upper surface of the image sensor is positioned lower than a lower surface of the first circuit board, and
wherein the plate shaped member overlaps the second circuit board in a direction parallel to an optical axis.