| CPC H04N 23/55 (2023.01) [G02B 1/115 (2013.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01)] | 18 Claims |

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1. A camera module, comprising:
an imaging lens assembly module; and
an image sensor disposed on an image surface of the imaging lens assembly module, and the image sensor comprising:
a photoelectric converting layer for converting a light signal of an imaging light to an electric signal;
a micro lens arrays layer for converging an energy of the imaging light into the photoelectric converting layer;
a light filtering layer disposed between the photoelectric converting layer and the micro lens arrays layer, and the light filtering layer for absorbing a light at a certain wavelength region of the imaging light; and
an anti-reflecting layer disposed on a surface of at least one of the light filtering layer and the micro lens arrays layer, wherein the anti-reflecting layer comprises an irregular nano-crystallite structure layer and an optical connecting layer, the optical connecting layer is for disposed on the surface of at least one of the light filtering layer and the micro lens arrays layer, and the optical connecting layer is connected to the irregular nano-crystallite structure layer;
wherein a top of the optical connecting layer is partially covered by the irregular nano-crystallite structure layer;
wherein the irregular nano-crystallite structure layer comprises a plurality of tapered ends.
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