US 12,452,510 B2
Camera module and optical device comprising same
Won Seob Shin, Seoul (KR); Tae Young Kim, Seoul (KR); and Woong Hwang, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Appl. No. 18/023,163
Filed by LG INNOTEK CO., LTD., Seoul (KR)
PCT Filed Aug. 26, 2021, PCT No. PCT/KR2021/011455
§ 371(c)(1), (2) Date Feb. 24, 2023,
PCT Pub. No. WO2022/045801, PCT Pub. Date Mar. 3, 2022.
Claims priority of application No. 10-2020-0107758 (KR), filed on Aug. 26, 2020.
Prior Publication US 2023/0319382 A1, Oct. 5, 2023
Int. Cl. H04N 23/54 (2023.01); G03B 30/00 (2021.01)
CPC H04N 23/54 (2023.01) [G03B 30/00 (2021.01)] 16 Claims
OG exemplary drawing
 
1. A camera module comprising:
a circuit board;
an image sensor disposed on the circuit board;
an adhesive member disposed on the circuit board to surround a side of the image sensor and including an opening;
a protrusion disposed in the opening of the adhesive member on the circuit board; and a sensor base disposed on the adhesive member,
wherein the sensor base includes a concave portion vertically overlapping the protrusion,
wherein the protrusion is inserted into the concave portion of the sensor base,
wherein the adhesive member has a closed loop shape surrounding an edge region of an upper surface of the circuit board apart from the side of the image sensor by a predetermined distance,
wherein a width of the opening of the adhesive member is the same as a width of the protrusion, and
wherein an outer surface of a cylindrical portion of the protrusion and an inner surface of the opening are in direct contact with each other.