| CPC H02S 40/34 (2014.12) [H02S 20/23 (2014.12); H02S 50/00 (2013.01)] | 20 Claims |
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1. A system, comprising:
a plurality of photovoltaic modules installed on a roof deck of a structure, wherein each of the plurality of photovoltaic modules comprise a plurality of photovoltaic substrings comprising a plurality of photovoltaic cells; and
a printed circuit board electrically connected to the plurality of photovoltaic modules installed on the roof deck of the structure, wherein the printed circuit board comprises:
at least one bypass diode configured to bypass, upon occurrence of a condition, at least one photovoltaic substring of the plurality of photovoltaic substrings;
a plurality of solder pads connected to the at least one bypass diode;
a channel; and
a casing connected to a first solder pad and a second solder pad of the plurality of solder pads, wherein the casing comprises:
a first low melting alloy and a second low melting alloy,
wherein when the first low melting alloy and the second low melting alloy reach a threshold temperature based on an event affecting the at least one bypass diode, the first low melting alloy and the second low melting alloy melt towards each other in the channel such that the first low melting alloy and the second low melting alloy connect to each other to form a continuous path between the first solder pad and the second solder pad, thereby shorting circuitry connecting at least one of the plurality of photovoltaic substrings to the first solder pad, the second solder pad, or a combination thereof, to provide a failsafe for the at least one of the plurality of substrings by bypassing the at least one bypass diode.
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