US 12,451,632 B2
Orthogonal circuit board interconnection systems
Alexander John Silverman, Wilmington, DE (US)
Assigned to Lockheed Martin Corporation, Bethesda, MD (US)
Filed by Lockheed Martin Corporation, Bethesda, MD (US)
Filed on Dec. 21, 2022, as Appl. No. 18/069,788.
Prior Publication US 2024/0213697 A1, Jun. 27, 2024
Int. Cl. H01R 12/73 (2011.01); H01R 12/72 (2011.01); H05K 1/14 (2006.01); H01R 12/55 (2011.01); H01R 13/24 (2006.01); H01R 13/405 (2006.01)
CPC H01R 12/737 (2013.01) [H01R 12/727 (2013.01); H05K 1/141 (2013.01); H01R 12/55 (2013.01); H01R 13/24 (2013.01); H01R 13/405 (2013.01); H05K 2201/10378 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system comprising:
a main circuit board;
a spring interposer connector comprising:
a plurality of signal spring pins, each signal spring pin electrically coupled to a respective signal of the main circuit board; and
a plurality of ground spring pins, each ground spring pin electrically coupled to a ground signal of the main circuit board; and
an orthogonal circuit board coupled to the main circuit board via an interface assembly, the interface assembly comprising:
a ground frame electrically coupled to a ground signal of the orthogonal circuit board;
a plurality of signal pins, each signal pin electrically coupled to a respective signal of the orthogonal circuit board; and
a plurality of dielectric retainers configured to electrically isolate the plurality of signal pins from the ground frame;
wherein:
the ground frame comprises an interface surface configured to electrically couple the ground frame to the plurality of ground spring pins of the spring interposer connector;
each particular signal pin of the interface assembly comprises a pin head configured to electrically couple the particular signal pin to a particular one of the plurality of signal spring pins of the spring interposer connector; and
the interface surface of the ground frame and the pin heads of the plurality of signal pins form a coplanar surface on the interface assembly.