| CPC H01Q 21/065 (2013.01) [H01Q 1/2283 (2013.01); H01Q 9/0414 (2013.01)] | 12 Claims |
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1. An antenna module implemented as a multi-layered package, the antenna module comprising:
a printed circuit board (PCB) having a plurality of layers;
an array antenna portion including a plurality of antenna elements disposed in and on the PCB,
wherein each of the plurality of antenna elements has a structure with two patch antennas, first patch antennas of the structure with two patch antennas being located on a first surface of the PCB, the first surface being an outermost surface of the PCB,
wherein second patch antennas of the structure with two patch antennas are disposed inside the PCB, and a portion of the first patch antennas and a portion of the second patch antennas are stacked to overlap each other;
a radio frequency integrated circuit (RFIC) chip bonded to a second surface of the PCB, the second surface being another outermost surface of the PCB; and
a plurality of signal connection lines connected from the RFIC chip to the array antenna portion,
wherein the plurality of signal connection lines are fed by being connected respectively from the RFIC chip to the second patch antennas of the structure with two patch antennas that are disposed inside the PCB,
a length of each of the plurality of signal connection lines is a length of a connection line connected between the RFIC chip and the second patch antennas, and
the plurality of signal connection lines have a same length,
wherein each of the plurality of signal connection lines is disposed between the second patch antennas disposed inside the PCB and the RFIC chip, and
each of the plurality of signal connection lines comprises:
a first part on the second surface of the PCB,
a third part forming a coplanar waveguide structure inside the PCB,
a second part electrically connecting the first part and the third part, and
a fourth part electrically connect the third part and one of the second patch antennas.
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