US 12,451,584 B2
Connection structure using elastic member and electronic device including the same
Sangyoon Lee, Suwon-si (KR); Junsig Kum, Suwon-si (KR); Sanghoon Park, Suwon-si (KR); Seungtae Ko, Suwon-si (KR); and Jungyub Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jul. 5, 2023, as Appl. No. 18/218,369.
Application 18/218,369 is a continuation of application No. PCT/KR2023/008879, filed on Jun. 26, 2023.
Claims priority of application No. 10-2022-0129130 (KR), filed on Oct. 7, 2022.
Prior Publication US 2024/0120636 A1, Apr. 11, 2024
Int. Cl. H01Q 1/24 (2006.01); H01Q 1/08 (2006.01); H01Q 1/48 (2006.01); H01Q 3/02 (2006.01)
CPC H01Q 1/085 (2013.01) [H01Q 1/246 (2013.01); H01Q 3/02 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a first radio frequency (RF) component;
a second RF component;
a ground structure having a first elasticity; and
a signal structure having a second elasticity,
wherein the signal structure electrically connects the first RF component and the second RF component,
wherein the ground structure comprises a plurality of protrusion portions and a connection portion including an opening,
wherein the signal structure comprises a substrate portion and a plurality of contact portions for electric connection, and
wherein the substrate portion of the signal structure and the plurality of contact portions of the signal structure are disposed in a space formed based on the opening of the connection portion of the ground structure.