US 12,451,578 B2
Interposers with millimeter-wave coaxial-to-waveguide transistions
Abdellatif Zanati, Hamburg (DE); Jonas Ove Harm, Hamburg (DE); and Adrianus Buijsman, Nijmegen (NL)
Assigned to NXP B.V., Eindhoven (NL)
Filed by NXP B.V., Eindhoven (NL)
Filed on Dec. 30, 2022, as Appl. No. 18/149,015.
Prior Publication US 2024/0224423 A1, Jul. 4, 2024
Int. Cl. H01P 5/103 (2006.01); H01P 5/08 (2006.01); H01Q 1/22 (2006.01); H05K 1/11 (2006.01); H01P 3/12 (2006.01)
CPC H01P 5/103 (2013.01) [H01P 5/085 (2013.01); H01Q 1/22 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H01P 3/121 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A device comprising:
an interposer circuit board (“interposer”) having a top surface and a bottom surface;
a first set of electrical contacts disposed on the top surface of the interposer;
a second set of electrical contacts disposed on the bottom surface of the interposer;
a coaxial transition structure formed by:
a first via that extends along a vertical direction from a feed contact belonging to the first set of electrical contacts to a first depth within the interposer; and
a set of additional vias that surround the first via and extend along the vertical direction from the top surface of the interposer to a second depth within the substrate interposer that is less than first depth;
wherein each of the set of additional vias are electrically short-circuited to each other and are separated from the first via by dielectric material of the interposer; and
a waveguide structure formed within the interposer beneath the set of additional vias that defines a volume in which wireless signals coupled to the waveguide structure propagate;
wherein the waveguide structure extends in a horizontal direction from a first waveguide end to a second waveguide end;
wherein the waveguide structure extends along a vertical direction from the second depth within the interposer to a third depth within the interposer that is greater than the second depth;
wherein the first via penetrates the waveguide structure at the first waveguide end and extends within the waveguide structure from the first depth to the second depth;
wherein the waveguide structure has an aperture at the third depth within the interposer at the second waveguide end where conductive material defining the waveguide is absent; and
wherein the coaxial transition structure and the waveguide structure are jointly configured and arranged to direct millimeter-wave energy delivered to the feed contact to the aperture in the waveguide structure.