US 12,451,458 B2
IC chip mounting device, and IC chip mounting method
Yoshimitsu Maeda, Tokyo (JP)
Assigned to SATO CORPORATION, Tokyo (JP)
Appl. No. 17/783,376
Filed by SATO HOLDINGS KABUSHIKI KAISHA, Tokyo (JP)
PCT Filed Dec. 25, 2020, PCT No. PCT/JP2020/048866
§ 371(c)(1), (2) Date Jun. 8, 2022,
PCT Pub. No. WO2021/132613, PCT Pub. Date Jul. 1, 2021.
Claims priority of application No. 2019-235374 (JP), filed on Dec. 26, 2019; and application No. 2020-216373 (JP), filed on Dec. 25, 2020.
Prior Publication US 2023/0019546 A1, Jan. 19, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 21/67 (2006.01)
CPC H01L 24/75 (2013.01) [H01L 24/743 (2013.01); H01L 24/83 (2013.01); H01L 21/67144 (2013.01); H01L 2224/75253 (2013.01); H01L 2224/75651 (2013.01); H01L 2224/82868 (2013.01); H01L 2224/82871 (2013.01); H01L 2224/82874 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83874 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An IC chip mounting apparatus comprising:
a conveyor configured to convey an antenna continuous body on a conveying surface, the antenna continuous body having a base material and plural inlay antennas continuously formed on the base material;
an ejection unit configured to eject a thermosetting adhesive toward a reference position of each antenna in the antenna continuous body;
an IC chip placement unit configured to place an IC chip on the adhesive that is located on the reference position of each antenna in the antenna continuous body;
a first light irradiator configured to irradiate the adhesive of each antenna with a first light, in the vicinity of a position where an IC chip is located on the conveying surface; and
a second light irradiator configured to irradiate the adhesive of each antenna with a second light, at a position downstream from a position where the adhesive is irradiated with the first light.