US 12,451,448 B2
Electromagnetic waveguiding through liquid cooling conduit
Anil Yuksel, Austin, TX (US); Jose A. Hejase, Pflugerville, TX (US); Junyan Tang, Austin, TX (US); Pavel Roy Paladhi, Pflugerville, TX (US); and Joshua Myers, Austin, TX (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed on Jun. 22, 2022, as Appl. No. 17/808,221.
Prior Publication US 2023/0420394 A1, Dec. 28, 2023
Int. Cl. H01L 23/66 (2006.01); H01L 23/473 (2006.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01); H01P 3/16 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 23/473 (2013.01); H01P 3/16 (2013.01); H01L 2223/6627 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A multi-chip package structure comprising:
a first IC chip and a second IC chip;
a fluid conduit thermally coupled to the first IC chip and the second IC chip, and configured to circulate fluid and remove heat generated by at least one of the first IC chip and the second IC chip, the fluid conduit having a first end and a second end opposite to the first end;
a first monopole feed connected between the first IC chip and the first end of the fluid conduit; and
a second monopole feed connected between the second IC chip and the second end of the fluid conduit,
wherein the first monopole feed is configured to transmit electromagnetic signals through the fluid conduit.