US 12,451,447 B2
Substrate embedded with integrated inductor and manufacturing method thereof
Xianming Chen, Guangdong (CN); Xiaowei Xu, Guangdong (CN); Juchen Huang, Guangdong (CN); Benxia Huang, Guangdong (CN); and Gao Huang, Guangdong (CN)
Assigned to Zhuhai ACCESS Semiconductor Co., Ltd., Guangdong (CN)
Filed by Zhuhai ACCESS Semiconductor Co., Ltd., Guangdong (CN)
Filed on Feb. 27, 2023, as Appl. No. 18/175,527.
Claims priority of application No. 202210490230.5 (CN), filed on May 6, 2022.
Prior Publication US 2023/0361058 A1, Nov. 9, 2023
Int. Cl. H01L 23/64 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/645 (2013.01) [H01L 21/4857 (2013.01); H01L 23/49822 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A manufacturing method for a substrate embedded with integrated inductor, comprising:
providing a bearing plate, wherein a metal layer is arranged on a surface of the bearing plate;
arranging a first conduction copper column on the surface of the bearing plate;
arranging a first dielectric layer on the surface of the bearing plate, which covers the first conduction copper column;
opening the first dielectric layer to form a first opening;
filling a magnetic material at the first opening;
grinding the first dielectric layer so that a surface of the first conduction copper column and a surface of the magnetic material are flush with a surface of the first dielectric layer;
removing the bearing plate, and etching the metal layer on the surface of the first dielectric layer to form a package substrate;
arranging a first circuit layer on an upper surface and a lower surface of the package substrate; and
arranging a solder mask layer on the upper surface and the lower surface of the package substrate, and forming a window in the solder mask layer corresponding to the first circuit layer.