US 12,451,445 B2
Protective elements for bonded structures
Javier A. DeLaCruz, San Jose, CA (US); Belgacem Haba, Saratoga, CA (US); and Rajesh Katkar, Milpitas, CA (US)
Assigned to Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US)
Filed by ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC., San Jose, CA (US)
Filed on Nov. 27, 2023, as Appl. No. 18/520,337.
Application 18/520,337 is a division of application No. 17/834,737, filed on Jun. 7, 2022, granted, now 11,848,284.
Application 17/834,737 is a continuation of application No. 16/844,941, filed on Apr. 9, 2020, granted, now 11,373,963, issued on Jun. 28, 2022.
Claims priority of provisional application 62/953,071, filed on Dec. 23, 2019.
Claims priority of provisional application 62/953,058, filed on Dec. 23, 2019.
Claims priority of provisional application 62/851,512, filed on May 22, 2019.
Claims priority of provisional application 62/833,491, filed on Apr. 12, 2019.
Prior Publication US 2024/0096823 A1, Mar. 21, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 23/528 (2006.01)
CPC H01L 23/573 (2013.01) [H01L 22/34 (2013.01); H01L 23/528 (2013.01); H01L 23/562 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/49 (2013.01); H01L 2224/08237 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/29187 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73215 (2013.01)] 26 Claims
OG exemplary drawing
 
1. A method of forming a bonded structure, the method comprising:
patterning a disruption structure into at least one of a semiconductor element having active circuitry and an obstructive element including an obstructive material disposed over at least a portion of the active circuitry, the obstructive material configured to obstruct external access to the active circuitry; and
directly bonding the obstructive element to the semiconductor element without an adhesive, the disruption structure configured to disrupt functionality of the semiconductor element upon debonding of the obstructive element from the semiconductor element.