US 12,451,441 B2
Semiconductor device having EMI shielding structure and related methods
Young Woo Lee, Gyeonggi-do (KR); Jae Ung Lee, Seoul (KR); Byong Jin Kim, Gyeonggi-do (KR); EunNaRa Cho, Incheon (KR); Ji Hoon Oh, Gyeonggi-do (KR); Young Seok Kim, Seoul (KR); Jin Young Khim, Seoul (KR); Tae Kyeong Hwang, Seoul (KR); Jin Seong Kim, Chandler, AZ (US); and Gi Jung Kim, Phoenix, AZ (US)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Valley Point (SG)
Filed on Nov. 17, 2023, as Appl. No. 18/512,301.
Application 18/512,301 is a division of application No. 17/832,952, filed on Jun. 6, 2022, granted, now 11,855,000.
Application 17/832,952 is a division of application No. 16/857,439, filed on Apr. 24, 2020, granted, now 11,355,449, issued on Jun. 7, 2022.
Application 16/857,439 is a division of application No. 15/632,335, filed on Jun. 24, 2017, abandoned.
Prior Publication US 2024/0088059 A1, Mar. 14, 2024
Int. Cl. H01L 21/06 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/552 (2013.01) [H01L 21/4853 (2013.01); H01L 21/486 (2013.01); H01L 21/4889 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 21/561 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3025 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A method of manufacturing an electronic device structure, comprising:
providing a substrate comprising:
a substrate top side;
a substrate bottom side; and
a substrate lateral side connecting the substrate top side to the substrate bottom side;
coupling a first electronic component to the substrate top side;
attaching conductive pillars to the substrate top side, wherein:
proximate ends of the conductive pillars are coupled to the substrate top side;
distal ends of the conductive pillars are spaced apart from the substrate top side;
the conductive pillars are laterally spaced apart from the first electronic component; and
the conductive pillars are oriented generally perpendicular to the substrate;
providing a package body encapsulating the first electronic component and the conductive pillars, wherein the package body comprising a top side and a lateral side;
providing recesses extending inward from the top side of the package body, wherein the recesses expose the distal ends of the conductive pillars, and wherein each recess comprises a floor defined by one of the distal ends of the conductive pillars; and
providing a conformal conductive layer over the top side of the package body, within the recesses, over the distal ends of the conductive pillars, and along the lateral side of the package body, wherein:
the conformal conductive layer contacts the distal ends of the conductive pillars below the top side of the package body;
the conductive pillars and the conformal conductive layer define a shielding structure for the electronic device structure; and
the conformal conductive layer is a continuous layer and is exposed outside of the electronic device structure.