US 12,451,439 B2
Bonded structure including an obstructive element directly bonded to a semiconductor element without an adhesive
Belgacem Haba, Saratoga, CA (US); Javier A. DeLaCruz, San Jose, CA (US); Rajesh Katkar, Milpitas, CA (US); and Arkalgud R. Sitaram, Cupertino, CA (US)
Assigned to Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US)
Filed by Adeia Semiconductor Bonding Technologies Inc., San Jose, CA (US)
Filed on Dec. 22, 2022, as Appl. No. 18/087,705.
Application 18/087,705 is a continuation of application No. 16/844,932, filed on Apr. 9, 2020, granted, now 11,610,846.
Claims priority of provisional application 62/953,058, filed on Dec. 23, 2019.
Claims priority of provisional application 62/833,491, filed on Apr. 12, 2019.
Prior Publication US 2023/0317628 A1, Oct. 5, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/552 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 23/573 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/83896 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A bonded structure comprising:
a semiconductor element comprising active circuitry and a first bonding layer; and
an obstructive element directly bonded to the semiconductor element without an adhesive along a bonding interface, wherein the obstructive element comprises a carrier element, a second bonding layer, and an optically obstructive material on the carrier element, wherein the optically obstructive material is disposed over the active circuitry, and wherein the second bonding layer is directly bonded to the first bonding layer without an adhesive along the bonding interface, the optically obstructive material to obstruct external optical access to the active circuitry.