US 12,451,427 B2
Fuse cell structure
Jhon Jhy Liaw, Hsinchu County (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jun. 26, 2024, as Appl. No. 18/755,298.
Application 18/755,298 is a continuation of application No. 18/362,290, filed on Jul. 31, 2023, granted, now 12,041,767.
Application 18/362,290 is a continuation of application No. 16/944,756, filed on Jul. 31, 2020, granted, now 11,758,714, issued on Sep. 12, 2023.
Prior Publication US 2024/0349495 A1, Oct. 17, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/525 (2006.01); G11C 17/16 (2006.01); H10B 20/20 (2023.01); H10B 20/25 (2023.01)
CPC H01L 23/5252 (2013.01) [G11C 17/16 (2013.01); H10B 20/20 (2023.02); H10B 20/25 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A device, comprising:
a first cell and a second cell adjacent to the first cell; and
a pair of stacked fuse elements shared by the first cell and the second cell;
wherein the pair of stacked fuse elements includes a plurality of metal plates stacked one over another and separated from each other by a plurality of insulators.